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dc.contributor.authorNesheiwat, Issa
dc.date.accessioned2021-10-04T15:53:11Z
dc.date.available2021-10-04T15:53:11Z
dc.date.issued2021-09
dc.identifier.urihttp://hdl.handle.net/20.500.12648/6964
dc.description.abstractWith the demand for increasing frequencies in today’s communications systems, compact integrated circuits are challenging to achieve. Compact filters have typically been realized by modifying the circuit design including using LC resonators, defective ground structures, and adjusting the length ratios of resonators. Heterogenous substrates with controlled regions of dielectric loading offer a new design approach when it comes to manufacturing an RF component. In this thesis, additive manufacturing is used to selectively place low-K and high-K dielectric materials to achieve a compact form factor, improved bandwidth, and higher suppression in re-entry modes. First, microstrip coupled strip lines are simulated to model the basic coupling effects of loading a substrate. Next, three 2.45GHz parallel coupled bandpass microstrip filters are designed with differing substrates: low-K, high-K and high-K loaded to analyze the impact of loading within the substrate. The filter substrates are manufactured using a dual-extrusion FDM 3-D printer to combine both dielectrics, low-K ABS, and high-K PrePerm ABS1000, into a single heterogeneous substrate. Compared to the low-K dielectric alternative, the high-K loaded filter demonstrated a 30.8% decrease in length, while maintaining similar bandwidth and suppression of re-entry modes. Compared to the high-K filter, the high-K loaded filter showed a 9.4dB reduction in re-entry mode suppression, while maintaining similar footprint size.en_US
dc.language.isoen_USen_US
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectResearch Subject Categories::TECHNOLOGY::Electrical engineering, electronics and photonics::Electrical engineeringen_US
dc.subject3D Printingen_US
dc.subjectAntennas (Electronics)en_US
dc.subjectMicrostrip antennasen_US
dc.subjectStrip transmission linesen_US
dc.subjectDielectricsen_US
dc.subjectEngineeringen_US
dc.title3-D printed heterogenous substrate bandpass filtersen_US
dc.typeThesisen_US
dc.description.versionNAen_US
refterms.dateFOA2021-10-04T15:53:12Z
dc.description.institutionSUNY College at New Paltzen_US
dc.description.departmentElectrical and Computer Engineeringen_US
dc.description.degreelevelMSen_US


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Attribution-NonCommercial-NoDerivatives 4.0 International
Except where otherwise noted, this item's license is described as Attribution-NonCommercial-NoDerivatives 4.0 International